电镀 - 关于电镀的双语例句 - 电镀造句 - 语文书

为您找到29个与“电镀”相关的双语例句：

Single plated nickel barrier terminations has excellent solder heat resistance for soldering.
外部电极为镍的电镀构造,于焊接时具有极优越的耐热性.
However, It'suffers from some problems such as tin whisker, surface color changes and bath mudding.
但纯锡电镀中存在着许多问题,如锡晶须、镀层变色及镀液混浊等.
The most commonly used letterpress duplicate plates are stereotypes , electrotypes, plastic plates and rubber plates.
活版最常用的复制版有铅铸版、电镀版、塑胶版和橡胶版.
This article electroplates aluminum on the substrate of 08 F steel and AZ 91 D magnesium alloy.
本文在08F钢和AZ91D镁合金上采用电镀铝的方法获得了铝镀层.
Suitable for electroplated, vitrified and metal bond tools, wheels etc.
适用于电镀、瓷、属结合剂体系磨具、轮、具制造.
Between electroplated layer and substrate level of electroplated sample is obviously stratified.
而电镀层与基体层之间有明显的分层现象.
In electroplated metals, these defects are primarily dislocations, twins, and deposited foreign atoms or molecular groups.
对于电镀的金属来说, 这些缺陷主要是位错, 孪晶和其沉积的异类,原子或分子基因.
The process of preparing diamond electrodeposited depressed saw blade was described.
介绍了电镀金刚石钹型锯片的生产工艺.
The process does not require electrical current or anodes as in electroplating.
但是在电镀过程中不需要电流或阳极.
A lot of sulfonated bodies applied in electroplating field were particularized.
列举了在电镀领域中实际应用到的各类磺化产物.
To galvanize or plate ( metal ) by immersion.
'电镀'.''通过浸泡镀涂金属.
Galvanization means coating metal with zinc, or the act of stimulating action.
电镀是指给金属覆上一层锌, 或是一种刺激反应的作用.
The surface can be treated with galvanization.
表面可电镀。
Eletroplate the trash of the generation in industry and source detailed see a table 1.
电镀工业中产生的废物及污染源详见表1.
Original plate: Relief printing plate produced bu 7 photomechanical etching as distinct from electrotyping.
原身版: 用照相晒版蚀刻方法造成的凸版.有别于电镀版.
In printing, a duplicate letterpress plate made from an original by electroplating.
在印刷技术中, 一种用电镀方法从原版复制成的印刷版.
Cloisonne - enameled in black, 24 k gold electroplate ( back is all gold ).
景泰蓝,搪瓷黑色, 24K金电镀 ( 背面是所有黄金 ).
Electrolysis is also used to plate one metal on another.
电解也用于将一种金属电镀在另一种金属上.
Cobalt - tungsten electrodeposit as copper barrier was presented in the paper.
本文提出以电镀钴钨二元合金镀层作为防铜渗层.
Application: Mainly used in dry cell, electroplating, dye and precision casting, curriery, etchant, feed additive etc.
用途: 主要用于电池、电镀、染纺、精密铸造、鞣革、蚀刻剂、饲料添加剂等方面.